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RF-star Offers Stardard Wireless RF Modules & Solutions, Customized RF HW & SW Solutions and OEM & ODM.

Certified Bluetooth 5.0 Low Energy Modules with TI CC2640 Chip RF-BM-4077B1

RF-BM-4077B1 is a Bluetooth LE5.0 module aimed at the smart things IoT markets. The module with 31 GPIOs enables it to meet relatively complicated applications. Start your design with the RF-BM-4077B1 CC2640R2F BLE module.

P/N:
RF-BM-4077B1
SoC:
CC2640R2FRGZ
Processor:
48 MHz ARM® Cortex®-M3
Protocols:
Bluetooth 5.0 low energy
Working Frequency:
2402 MHz ~ 2480 MHz
Package (mm):
23.5 × 17.0 × 1.7, half-hole, 1.27 pitch, 36-pin
Features:
LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), Advertising extension
GPIO:
31
Max. TX Power:
+5 dBm
Transmission Range:
120 m

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RF-BM-4077B1 is a 2.4GHz RF module based on TI CC2640 wireless SoC supporting Bluetooth Low Energy stack v4.2 or v5.0. The module has integrated a 24 MHz crystal, a 32.768 kHz crystal, an LC balun, and an inverted-F PCB antenna. CC2640R2F in RF-BM-4077B1 contains a 32-bit ARM Cortex-M3 main processor at 48 MHz, and its 2.4 GHz radio processes a very low active current and outstanding RF performance. RF-BM-4077B1 can use AT commands to set parameters, which allows users to quickly connect their applications to build a reliable BLE connection. This module fits into a wide range of BLE applications where robust connection, long battery lifetime, small form factor, and ease of use are important.

Bluetooth 5.0 Low Energy CC2640R2F Modules

- BLE 5.0 Transparent Transmission (Bridge) Protocol -

· Single role of slave, Single role of master

· Custom Service UUID

· Connection Password

· Data rate: 1 Mbps, 2 Mbps, 500 kbps, 125 kbps

· Advertising extension packets

BLE 5.0 Transparent Transmission of Bluetooth 5.0 Low Energy CC2640R2F Modules

- BLE 4.2 Transparent Transmission (Bridge) Protocol -

· Several roles: slave, master, master-slave

· Adjustable parameters: baud rate, connection interval, broadcast interval, TX power…

· Connection Password

BLE 4.2 Transparent Transmission module key features

Related Resources:

Bluetooth 5.0 Module with Automotive-grade Chip CC2640R2F-Q1

Differences Between TI CC2640R2L and CC2640R2F

Test Board Pinboard for TI Series Module (CC2540 CC2541 CC2640)

Wireless SoC:

48 MHz ARM® Cortex®-M3 processor
TX power: Up to +5 dBm
Sensitivity in BLE mode: -97 dBm
Memory

-128 kB flash
-20 kB SRAM

Supported Protocols:

Bluetooth 4.2 low energy
Bluetooth 5.0 low energy

Current Consumption:

2.71 μA in sleep mode
38.11 μA at 200 ms broadcast cycle (disable the internal EN pull-up)
188.72 μA at 20 ms connection cycle (disable the internal EN pull-up)

Operating Range:

Supply voltage range 1.8 V ~ 3.8 V
Working temperature range: -40 °C ~ +85 °C

Rich Peripherals:

12-bit ADC
31 GPIOs
SPI
I²C
I²S
RTC
UART (CTS/RTS)
AES-128

RF-BM-4077B1 Hardware Datasheet V1.1_20230526

TI CC264x Series BLE Modules
Part Number	RF-BM-2642B1	RF-BM-4077B2	RF-BM-4055B1L	RF-BM-4077B1L	RF-BM-4077B1	RF-BM-4044B5	RF-BM-4044B4	RF-BM-4044B3	RF-BM-4044B2
Photo
IC	CC2642R	CC2640R2F-Q1	CC2640R2LRHB	CC2640R2LRGZ	CC2640R2FRGZ	CC2640R2FRSM	CC2640R2FRSM	CC2640R2FRSM	CC2640R2FRSM
Core	48 MHz ARM® Cortex®-M4F	48 MHz ARM® Cortex®-M3	48 MHz ARM® Cortex®-M3	48 MHz ARM® Cortex®-M3	48 MHz ARM® Cortex®-M3	48 MHz ARM® Cortex®-M3	48 MHz ARM® Cortex®-M3	48 MHz ARM® Cortex®-M3	48 MHz ARM® Cortex®-M3
Antenna	PCB	PCB	PCB	PCB	PCB	Chip/Half-Hole Interface	Chip/Half-Hole Interface	IPEX	PCB
RAM	88 KB	28 KB	28 KB	28 KB	28 KB	28 KB	28 KB	28 KB	28 KB
Flash	352 KB	128 KB	128 KB	128 KB	128 KB	128 KB	128 KB	128 KB	128 KB
Protocols	BLE5.3	BLE5.3	BLE5.3	BLE5.3	BLE5.3	BLE5.3	BLE5.3	BLE5.3	BLE5.3
Power Supply	1.8 V ~ 3.8 V, recommend to 3.3 V	1.8 V ~ 3.8 V, recommend to 3.3 V	1.8 V ~ 3.8 V, recommend to 3.3 V	1.8 V ~ 3.8 V, recommend to 3.3 V	1.8 V ~ 3.8 V, recommend to 3.3 V	1.8 V ~ 3.8 V, recommend to 3.3 V	1.8 V ~ 3.8 V, recommend to 3.3 V	1.8 V ~ 3.8 V, recommend to 3.3 V	1.8 V ~ 3.8 V, recommend to 3.3 V
Frequency	2.4 GHz	2.4 GHz	2.4 GHz	2.4 GHz	2.4 GHz	2.4 GHz	2.4 GHz	2.4 GHz	2.4 GHz
Max. TX Power	+5 dBm	+5 dBm	+5 dBm	+5 dBm	+5 dBm	+2 dBm	+2 dBm	+2 dBm	+2 dBm
Receiving Sensitivity	-97 dBm @ BLE 1M PHY -105 dBm @ 125 kbps LE Coded PHY	-97 dBm @ BLE 1M PHY -103 dBm @ 125 kbps LE Coded PHY	-97 dBm @ BLE 1M PHY -103 dBm @ 125 kbps LE Coded PHY	-97 dBm @ BLE 1M PHY -103 dBm @ 125 kbps LE Coded PHY	-97 dBm @ BLE 1M PHY -103 dBm @ 125 kbps LE Coded PHY	-97 dBm @ BLE 1M PHY -103 dBm @ 125 kbps LE Coded PHY	-97 dBm @ BLE 1M PHY -103 dBm @ 125 kbps LE Coded PHY	-97 dBm @ BLE 1M PHY -103 dBm @ 125 kbps LE Coded PHY	-97 dBm @ BLE 1M PHY -103 dBm @ 125 kbps LE Coded PHY
GPIO	31	31	13	31	31	10	10	10	10
Working Temperature	-40 ℃ ~ +85 ℃	-40 ℃ ~ +105 ℃	-40 ℃ ~ +85 ℃	-40 ℃ ~ +85 ℃	-40 ℃ ~ +85 ℃	-40 ℃ ~ +85 ℃	-40 ℃ ~ +85 ℃	-40 ℃ ~ +85 ℃	-40 ℃ ~ +85 ℃
Storage Temperature	-40 ℃ ~ +125 ℃	-40 ℃ ~ +125 ℃	-40 ℃ ~ +125 ℃	-40 ℃ ~ +125 ℃	-40 ℃ ~ +125 ℃	-40 ℃ ~ +125 ℃	-40 ℃ ~ +125 ℃	-40 ℃ ~ +125 ℃	-40 ℃ ~ +125 ℃
Transmission Range	110 m @ 1M PHY 160 m @ LE Coded PHY	100 m @ 1M PHY 150 m @ LE Coded PHY	60 m @ 1M PHY 90 m @ LE Coded PHY	70 m @ 1M PHY 100 m @ LE Coded PHY	80 m @ 1M PHY 110 m @ LE Coded PHY	Chip Antenna 30 m @ 1M PHY 60 m @ LE Coded PHY	Chip Antenna 20 m @ 1M PHY 50 m @ LE Coded PHY	External PCB antenna 110 m @ 1M PHY 150 m @ LE Coded PHY	60 m @ 1M PHY 90 m @ LE Coded PHY
Dimension (mm)	23.5 x 17.0 x 2.2	23.5 x 17.0 x 2.2	15.2 x 11.2 x 1.7	23.5 x 17.0 x 1.7	23.5 x 17.0 x 1.7	10.5 x 8.5 x 2.0	8.0 x 8.0 x 1.5	15.2 x 11.2 x 2.1	16.6 x 11.2 x 1.7
Package	1.27-mm pitch half-hole	1.27-mm pitch half-hole	1.27-mm pitch half-hole	1.27-mm pitch half-hole	1.27-mm pitch half-hole	1.27-mm pitch half-hole	1.27-mm pitch half-hole	1.27-mm pitch half-hole	1.27-mm pitch half-hole
OTA	√	√	√	√	√	√	√	√	√
Bluetooth Mesh	√	×	×	×	×	×	×	×	×
Long Range	√	√	√	√	√	√	√	√	√
2Mbps PHY	√	√	√	√	√	√	√	√	√
AoA/AoD	√	√	×	×	√	√	√	√	√
UART Protocol	Master-slave simultaneously	Master/Slave	Master/Slave	Master/Slave	Master/Slave	Master/Slave	Master/Slave	Master/Slave	Master/Slave
Functions	High anti-interference performance	AEC-Q100 Grade, High anti-interference performance	High Cost-Effective	High Cost-Effective	31 GPIOs for more avaliable applications	Small dimension, Double-side pads	Ultra-small dimension	Feasible for external antennas	High stablity

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