How RF-star & Industries Are Moving Forward
  • RF-star Redefines Automotive Wireless Solutions with New BLE Module Lineup
    RF-star Redefines Automotive Wireless Solutions with New BLE Module Lineup May 15, 2024
    RF-star, a leading manufacturer of wireless modules and provider of wireless connectivity solutions, proudly announces the expansion of its Bluetooth module lineup tailored specifically for automotive applications. The latest BLE modules include the RF-BM-2642QB1I and RF-BM-2340QB1, designed to excel in automobile-critical applications such as digital car keys, T-Box, Tire Pressure Monitoring Systems (TPMS), Passive Entry Passive Start (PEPS), and more. Designed to meet the evolving demands of the automotive industry, RF-star's new modules offer a host of features to enhance reliability, durability, security, and ease of integration. Compliance and security assurance are paramount in automotive applications. RF-star’s new Bluetooth Low Energy modules are based on TI chips, specifically the CC2642R-Q1 and CC2340R5-Q1 MCUs meeting Automotive Electronics Council (AEC-Q100) standards. RF-BM-2642QB1I and RF-BM-2340QB1 BLE modules integrated with the automotive-qualified MCUs can operate in Grade 2 temperature range (–40 °C to +105 °C), guaranteeing their reliability and durability in harsh automotive environments. Additionally, RF-star's CC2642R-Q1 and CC2340R5-Q1 modules incorporate AES 128-and 256-bit cryptographic accelerator, ECC and RSA public key hardware accelerator and true random number generator(TRNG). These advanced security enablers with robust encryption protocols and authentication mechanisms, provide peace of mind to both automakers and end-users. Rich resources and ease of use are also taken into consideration by project decision-makers. Their high-performance processor and abundant resources, eg., RF-BM-2340QB1 with 512 kB Flash and 36 kB RAM, offer ample opportunities for firmware development. Meanwhile, they also support over-the-air upgrade (OTA). Besides, the automotive modules feature UART, SPI, I2C, I2S, ADC and more digital peripherals, flexible RF output modes(eg., PCB antenna, IPEX connector and half-hole ANT RF pin), and user-friendly development kits. Hence, it is quite easy to integrate into existing vehicle architectures, especially the auto aftermarket applications. Best of all, both support Bluetooth 5.0 Low Energy serial port transmission for master-slave wireless connections. These rich functions with AT commands streamline the integration process, reducing complexity and accelerating time-to-market for automotive projects. Whether experienced engineers or newcomers to wireless connectivity, they can leverage RF-star's Bluetooth modules easily to unlock their full potential in ongoing projects. RF-star - A powerful supplier with abundant experience stands out among competitors. Certified with ISO9001 and IATF16949 (automotive sector quality management systems), the enterprise and the manufacturer meticulously adhere to international quality management standards. RF-star is also honored as a member of the Car Connectivity Consortium (CCC) and Intelligent Car Connectivity Industry Ecosystem Alliance (ICCE). Beyond indis...
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  • RF-star Showcased CC2340 Bluetooth LE Modules in TI Embedded Innovation Seminar
    RF-star Showcased CC2340 Bluetooth LE Modules in TI Embedded Innovation Seminar Dec 01, 2023
    On November 28-30, RF-star, a leading RF wireless modules manufacturer, is honored to present its new CC2340 Bluetooth Low Energy modules and solutions, at the TI Embedded Technology Innovation and Development Seminar (Shanghai and Shenzhen Station) organized by Texas Instruments, a global semiconductor giant. This premier event brought together industry leaders, experts, ecological partners and enthusiasts to explore the latest advancements and opportunities in TI’s new-generation embedded products and applications. As TI’s partner, RF-star was invited to attend the seminar and interacted with industry representatives to discuss the embedded technology trends. In this seminar, Texas Instruments showcased the new Arm® Cortex® -M0+MCU product portfolio, new-generation Sitara AM6x series processors, TI CC2340x Bluetooth LE MCUs and C2000TM Real-Time microcontrollers. TI’s experts also shared Wi-Fi 6 for IoT applications and low-power consumption Radar solutions. The leading wireless innovation, comprehensive embedded processor portfolio, cutting-edge system solutions, easy-to-use platforms and tools would help engineers develop and push their target projects to market quickly. RF-star presented the CC2340R5 wireless modules based on TI Bluetooth Low Energy MCUs in the seminar exhibition hall. RF-BM-2340B1(I), as RF-star’s first CC2340R5 series Bluetooth LE modules features high-quality RF performance, ultra-low power consumption, adequate security and competitive price. BLE5.0 transparent transmission protocol (serial port protocol), rich AT commands, and CE, FCC, BQB certifications, can simplify project development and accelerate the products to market. The CC2340 Bluetooth modules designed by RF-star enable wireless connectivity in building automation, grid infrastructure, medical devices, appliances, personal electronics, retail automation and more applications. The Bluetooth digital key, UWB digital key, T-Box, BMS, TPMS, Bluetooth charging pile and other vehicle solutions embedded RF-star wireless modules attracted attendees to engage in potential business cooperation. In the future, RF-star will explore wireless connectivity innovation in the automotive industry. The successful event not only brought great influence to TI's partner ecosystem but also played an important role in the development of embedded technology. Thanks to the impressive seminar, RF-star was pleased to forge new connections with industry experts and looked forward to working with TI partners to propel wireless technological innovation and expand more possible embedded applications. Click here for RF-star wireless modules RF-BM-2340x based on CC2340Rx. For more information, visit or reach us by email address About RF-star Shenzhen RF-star Technology Co., Ltd (RF-star) is a leading global provider of wireless communication modules and solutions, specializing in low-power modules for IoT, industrial, automotive, and consumer appli...
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  • RF-star Joins Car Connectivity Consortium to Accelerate UWB Digital Keys
    RF-star Joins Car Connectivity Consortium to Accelerate UWB Digital Keys Nov 21, 2023
    Shenzhen, Guangdong, China, -Nov. 21, 2023 / -- RF-star, a leading provider of wireless module solutions, is pleased to announce its membership in the Car Connectivity Consortium (CCC) to further progress with the development of Bluetooth + Ultra Wide Band (UWB)+NFC digital keys for the automotive industry. In July 2022, the CCC launched the latest Digital Key Release 3 V 1.1. The universal cross-industry standard adds UWB in combination with Bluetooth® Low Energy connectivity and Near Field Communication (NFC) to have contactless, location-aware, and secure communication between smartphones and vehicles. RF-star, as a pioneer in wireless IoT technologies of BLE, UWB, NFC, ZigBee, Matter, Thread, Wi-SUN, etc. has been developing a complete set of automotive digital key solutions combined with the UWB, Bluetooth® Low Energy, and NFC technologies. UWB, a cutting-edge technology that utilizes radio waves to measure distances with extreme precision, is a key component of RF-star's digital key solutions. Integrated with UWB technology, the new solution based on its own automotive-grade chip modules not only ensures secure and reliable communication between smartphones and vehicles, but also enables advanced features such as accurate ranging and remote vehicle control. Since 2010, RF-star has been engaging in the wireless connectivity area, especially in BLE technology for more than 10 years. In former BLE PEPS solutions, RF-star several automotive-grade Bluetooth modules have been successfully installed into cars and mass-produced, such as low-power modules based on TI CC2642R-Q1. The previously released CC2340R5 module RF-BM-2340B1 and its subsequent CC2340 series modules are also suitable for digital key applications. This series of modules has made Bluetooth Low Energy car access antenna node reference design. Hence, RF-star's expertise in BLE technology and Bluetooth modules complements its UWB digital keys, easily achieving identity authentication, data interaction, and long-range positioning with ultra-low-power consumption. The combination of these technologies realizes a 40m-100m wake-up service and starts the engine with pinpoint accuracy within decimeter-level positioning. The introduction of UWB offers unparalleled convenience and security beyond today’s classic keys. What's more, as a new member of the Intelligent Car Connectivity Industry Ecosystem Alliance (ICCE) in the first half of the year, RF-star with major players had been fortunate to draft UWB System Requirements to advance the development of digital key systems. “With the implementation of the CCC digital key, the vehicle-to-device connectivity is imperative. It is a great honor to be a member of the CCC at this time and participate in the innovation of this wireless connectivity,” said King Kang, CEO of RF-star. “RF-star will propel unceasingly the development of the Internet of Vehicles industry and jointly build UWB ecosystem with global leading RF chipsets, carmakers...
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  • RF-star CC2340R5 Bluetooth5.3 Low Energy ZigBee Modules Go Live on TI Site
    RF-star CC2340R5 Bluetooth5.3 Low Energy ZigBee Modules Go Live on TI Site Oct 26, 2023
    RF-star, a leading global provider of IoT (Internet of Things) wireless solutions and wireless RF modules, is thrilled to announce that its CC2340R5 Bluetooth Zigbee modules have been officially listed on the Texas Instruments (TI) website and marketed around the globe. RF-star new products’ access to TI shows high recognition of its wireless modules again, further strengthening their longstanding partnership. Designing Low-Power Modules and Wireless Solutions Based on TI’s Chips RF-star launched the first BLE module in 2010 and has been TI's official IDH for over a decade. RF-star has created sustainable collaboration by developing CC2652 series (CC2652R, CC2652RB, CC2652P, CC2652R7 and CC2652P7) 2.4GHz RF modules and CC1352 series (CC1352R, CC1352P, CC1352R7 and CC1352P7) multi-band wireless modules. These modules respectively support multiple protocols like Zigbee, Thread, Bluetooth Low Energy, 6LoWPAN, MIOTY, Bluetooth mesh, Wi-SUN, and more. What’s more, the DMM (Dynamic Multiprotocol Management) enables the modules to work with different RF protocols simultaneously. They are widely used in IoT systems, medical devices, smart homes, sensor networks, industrial automation, smart grids, and remote controls. RF-star low-power Bluetooth modules and solutions based on the former generations of TI CC254x (CC2540 and CC2541), and CC264x (CC2640 and CC2642) chips can work in Bluetooth Low Energy serial port transparent transmission (bridge) protocols. The 2.4GHz BLE modules with UART port design can be regarded as a slave, a master, or a master-slave simultaneously, or a Beacon. The Bluetooth solutions greatly shorten the development circle and have won the favor of new energy vehicles, consumer electronics, health and medical equipment, sports and fitness, retail, and industrial applications. 5 RF-star CC2340R5 Bluetooth ZigBee Modules Are Available Now The CC2340R5 series listed on TI’s official website this time has 5 models. All of them are embedded with the UART transparent transmission protocol. The RF-BM-2340B1 (PCB antenna) and RF-BM-2340B1I (IPEX version) wireless modules have been announced as Pin-2-Pin compatible. They offer 24 GPIOs for rapid development and can be utilized as MCU modules with I2C, SPI, and UART peripheral applications. Their versatile applications range from medical and automobile to new energy and industrial sectors. Similarly, the RF-BM-2340A2 (PCB antenna) and RF-BM-2340A2I (IPEX version) modules are also Pin-2-Pin compatible. Featuring 12 GPIOs and a wide array of BLE5.2 serial port AT commands, these modules offer abundant possibilities. The small size and cost-competitive design make them suitable for various portable medical and consumer electronic applications. As for the RF-BM-2340C2 Bluetooth LE module with a chip antenna, it boasts a compact size of 8 mm × 8 mm. This ultra-compact module is specifically designed for applications that demand smaller dimensions and require shorter transmission ranges. Over...
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  • Review on RF-star Exhibition at IOTE2023 in Shenzhen
    Review on RF-star Exhibition at IOTE2023 in Shenzhen Sep 25, 2023
    On Sep. 22nd  2023, the 20th International Internet of Things Exhibition (IOTE 2023) was rounded off at Shenzhen World Expo Exhibition & Convention Center. As one of the exhibitors, RF-star presented a lineup of standout RF modules and advanced wireless IoT solutions, attracting masses of attendees from diverse industries to delve into our innovative solutions. Figure 1 RF-star Displayed Its Wireless Modules and IoT Applications At the exhibition, a series of wireless modules with BLE, Wi-Fi, ZigBee, Sub-1G, Thread, Matter and UWB protocols including CC2340, CC2530, CC2652, CC2651, CC1310, CC1312R, CC1352, EFR32BG22, EFR32BG24, EFR32MG24, nRF52810, nRF52832, nRF52840 series and the Bluetooth Beacon devices were on show. Besides, it focused on showcasing excellent IoT application solutions, eg. portable medical devices, Bluetooth PEPS, EV chargers, BMS, UWB digital key, and micro-inverters. The cutting-edge products and applications made a big splash in the IoT field. Figure 2 RF-star Team Shared Wireless Modules and Solutions RF-star's team engaged in extensive discussions and interactions with visitors at the exhibition. They showcased the stunning features and advanced technologies of RF-star products, along with use cases in various industries. The participants highly appreciated the rich function and high performance of RF-star's wireless solutions, leading to thought-provoking discussions. Figure 3 RF-star Marketing Director Leo Exchanged Ideas with Partners Furthermore, RF-star actively participated in productive discussions and dialogues with fellow exhibitors and industry partners. We shared the latest industry trends, challenges, and opportunities, explored the possibility of cooperation, and sought mutual growth. These interactions serve as a strong basis for forming solid partnerships in the future. The IOTE2023 exhibition came to an end, while IOT development never stops evolving. We would like to thank all visitors, partners, and staff for their support and attention. With the vision of “Wireless Creates Infinite Possibilities”, RF-star will keep up with IoT trends and technology, and continue to provide innovative wireless products and solutions to empower the Internet of Things industry to seamlessly connect with the world. About RF-star Shenzhen RF-star Technology Co., Ltd. (RF-star) is a leading supplier of wireless RF solutions and low-power modules with an excellent industry reputation and credibility. As the official third-party IDH of Texas Instruments for more than a decade and a trusted partner for customers worldwide, RF-star delivers expertise in design, manufacturing, production, and customized development. For more information, please contact us below: Website: E-mail: Social media:
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  • RF-star to Join IOTE 2023 Shenzhen
    RF-star to Join IOTE 2023 Shenzhen Aug 23, 2023
    Shenzhen RF-star Technology Co, Ltd. (RF-star), one of the world's top 3 wireless module manufacturers, will be an exhibitor in 2023 at the 20th International Internet of Things Exhibition (IOTE 2023). The event will be held at Shenzhen World Exhibition & Convention Centre (Baoan), China, from 20th to 22nd September. RF-star will be in Booth 10B13 and welcome all visitors coming to the booth to discover a variety of RF-star wireless RF products and innovative IoT solutions. IOTE 2023 is Asia's largest and most influential IoT expo. It exhibits the advanced technologies of RFID, IoT, sensor networks, wireless communication(like Bluetooth/ZigBee/UWB), smart retail and smart home, etc. RF-star’s CC2340 module is its new Bluetooth 5.3 LE ZigBee module - a device designed for ultra-low power wireless applications like smart homes, medical devices, industrial sensors, and automotive applications. As a forerunner in the wireless IoT arena, RF-star is invited to showcase its latest modules with BLE, WiFi, ZigBee, Sub-1G, Thread, Matter and UWB protocols including CC2340, CC2530, CC2652, CC2651, CC1310, CC1312R, CC1352, EFR32BG22, EFR32BG24, EFR32MG24, nRF52810, nRF52832, nRF52840 series, the Bluetooth Beacon devices. Besides, its excellent IoT applications integrated the cutting-edge wireless connectivity technology will also be displayed, covering portable medical devices (BGM, CGM and pulse oximeter), Bluetooth PEPS, EV charger, BMS, UWB digital key, micro-inverter, etc. With its advanced technology&instruments, experienced development teams, and global resources, RF-star is dedicated to providing easier and smarter wireless connectivity among different industries across the globe. Visitors attending the fair are welcome to visit our booth. For more information about the event, visit For more information on RF-star products and solutions, email, or visit
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  • New CC2340 BLE Modules Enable Industries with High-Quality RF and Power Performance
    New CC2340 BLE Modules Enable Industries with High-Quality RF and Power Performance Aug 17, 2023
    RF-star today rolled out its BLE module portfolio based on TI’s new CC2340 wireless microcontrollers (MCU) that enable high-quality Bluetooth® Low Energy (LE) modules much cheaper than the competing devices. Featuring top-ranking standby current and radio-frequency (RF) performance, the Bluetooth LE CC2340 modules are positioned for ultra-low power wireless applications, such as smart homes, medical devices, industrial sensors, and automobiles (like EV chargers and PEPS) at a lower price, making them affordable for engineers to add Bluetooth LE connectivity modules to more products. According to the 2023 Bluetooth Market Update released by the Bluetooth Special Interest Group (SIG), ABI Research anticipates a higher growth in the Bluetooth market over the next five years. By 2027, 7.6 billion Bluetooth-enabled devices will be shipping annually, representing a nine percent compound annual growth rate (CAGR). Driven by continued strong growth in peripheral devices, Bluetooth® LE single-mode device shipments are forecasted to more than double over the next five years. Figure 1 Single-Mode Bluetooth® LE Device Growth (numbers in billions) It follows that Bluetooth LE technology is still all the rage. As one of the Bluetooth SIG members, Texas Instruments is dedicated to Bluetooth technology to meet the growing demands for enhanced wireless connectivity in a wider range of applications. Last year, TI announced its fourth-generation Bluetooth LE Wireless MCUs, which is the CC2340 family featured with best-in-class standby current and ultra-low power radio-frequency (RF) performance. The CC2340 device family provides a highly integrated wireless connectivity function with support for Bluetooth 5.3 Low Energy, ZigBee, and proprietary 2.4GHz protocols. So far, the family has two latest ultra-low power additions: CC2340R5 and CC2340R2. The CC2340R2 MCU provides 256 KB Flash, 28 KB SRAM, and 12 I/O pads, while the advanced version ― CC2340R5 offers an in-system programmable flash of 512 KB, an ultra-low leakage SRAM of 36 KB, and up to 26 I/O pads. Additionally, both of them share the same MCU architecture to support OTA and a wide selection of peripherals communication interfaces such as UART, SPI, I2C, timer, temperature sensor, battery monitor, analog comparator, and ADC analog-to-digital converter, etc. Based on TI’s new-level wireless MCUs, RF-star CC2340 modules with high-quality RF and power performance will have a broad range of wireless connectivity applications, such as smart homes, medical, industrial sensors, and automobiles. Figure 2 CC2340R5 module series Let’s have a quick preview of the irresistible features of RF-star CC2340 modules. CC2340 Modules with High-Quality RF and Power Performance at An Affordable Price The CC2340 BLE modules have an industry-leading standby current of less than 710 nA, which is 40% lower than competing devices. Up to 10 years of service life on a coin cell battery can be ...
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  • RF-star Announces Headquarters Relocation
    RF-star Announces Headquarters Relocation Aug 01, 2023
    SASKATOON, Saskatchewan, Canada, Jul. 31, 2023 / For Immediate Release/ -- RF-star, a leader in wireless modules and IoT Radio Frequency solutions in China, announced today the relocation of its corporate headquarters to Podium Building No. A-12 in Nanshan district, Shenzhen, Guangdong to advance the operations and growth of the company. Figure1 RF-star's New Workplace in Shenzhen The celebration of move-in was held on Jul. 26, 2023. Texas Instruments, SEKORM, and many other partners brought flowers and presents to congratulate RF-star on its housewarming. Figure2 Flowers and Presents from RF-star Partners The corporate new office is in Room 502-503, Podium Building No. A-12, Shenzhen Bay Science and Technology Ecological Park, Nanshan District, Shenzhen, Guangdong, China. Expanding to 8,000 square feet at Shenzhen Bay Science and Technology Ecological Park in 2023, and 3,000 square feet at the Global Center in Chengdu in 2022, each location is a substantial upgrade from the Company's prior offices and will provide the necessary infrastructure for the corporate to continue to build on its current momentum and sales in Chinese and International markets. “We are greatly pleased for our partners to be here today to celebrate this housewarming with RF-star staff. Founded in 2010, in the past 13 years, RF-star has witnessed glorious moments and also encountered various uncontrollable factors during the epidemic. Although there are hardships in the progress, they don’t affect our sustainable development,” said Ben Qiu, GM of RF-star. “Thank you all for your support and our employees for their joint efforts, so that we can stand on this today and create a more brilliant moment together.” At last, he wished RF-star business to flourish like Bamboo to start its new journey and create a new future! Figure3 RF-star Leaders Snapshot King Kang, CEO of RF-star, says: “It is my regret that I could not witness the relocation of RF-star headquarters with you, but I can still enjoy the housewarming celebration online in Canada. Many thanks to all partners, customers and staff, the consistent development and growth of RF-star are absolutely inseparable from you.” Kang states: “In just a few years, our subsidiaries and branches in Canada, Chengdu, and Suzhou were established successively, and we will witness more new branches of RF-star in the future. As a pioneer in the wireless Internet of Things (IoT) area, RF-star with the vision of “Wireless Creates Infinite Possibilities”, has engaged itself in empowering different industries. We are willing to set up a better team to support our development and be cooperating with you to create a more intelligent society.” About RF-star Shenzhen RF-star Technology Co., Ltd. (RF-star) is a leading supplier of wireless RF solutions and low-power modules with an excellent industry reputation and credibility. As the official third-party IDH of Texas Instruments for more than a decade and a trusted partner for customers worldwide,...
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  • Wi-SUN Products Launch Anouncement!  ——RFstar Has Joined Hands with TI to Develop Wide-Area Mesh!
    Wi-SUN Products Launch Anouncement! ——RFstar Has Joined Hands with TI to Develop Wide-Area Mesh! Jun 24, 2022
    Recently, RF-star, a veteran wireless IoT company in China, announced that it has joined hands with Texas Instruments to launch several Wi-SUN products, focusing on the development of wide-area mesh, hoping to provide customers with integrated solution development environment of end-edge-cloud in the field of industrial IoT and public facilities. The products disclosed by the company include a variety of Wi-SUN communication modules based on the TI CC1352 and CC1312 series, which support Sub1G multi-band and 2.4GHz communication, and support self-organizing networks by mesh and multi-hop. The distance of a single hop can reach several kilometers. Development history of Wi-SUN Even for most people in the IoT circle, Wi-SUN is a new technology. Actually it has been created for more than a dozen years. However it floated only in recent years after more major chip vendors and device manufacturers joined the technology alliance and started to promote the technology. As early as 2008, there was no unified wireless communication standard for the Wide Area network in the industry, while there were various wireless communication protocols in the industry at that time. What these protocols have in common is that they adopted the IEEE 802.15.4 standard. But they still cannot achieve interconnection in the application layer. In order to solve this complex problem, Wi-SUN FAN (Wireless Utility Field Area Network), a large-scale wireless mesh network based on IP technology came into being. The standard is committed to becoming the global wireless mesh network standard with interoperability. With the implementation of the standard, Wi-SUN alliance was established in 2012. Currently, the alliance has more than 250 members worldwide, including Cisco, ARM, Texas Instruments and Itron, etc. Over the past two years, the Wi-SUN standard has matured, and hundreds of millions of Wi-SUN enabled devices have been deployed worldwide. It is widely used in public utilities and smart city facilities due to its feature of enabling smart meters, smart street lights and other devices to be connected to a public network. Wi-SUN technology is an open specification based on IEEE 802.15.4g, IEEE 802 and IETF IPv6 standard protocols. Wi-SUN FAN is a mesh network protocol that support self organizing and self-healing functions. Each device in the network can communicate with its neighbors, and signals can be transmit to each node in the mesh, making very long range hops in between. Wi-SUN features long distance transmission, security, high scalability, interoperability, easy deployment, mesh network, as well as low power consumption (the battery life of Wi-SUN modules has a chance to It can be used for ten years). It is widely used in smart meters and family intelligent energy management (HEMS) controllers for communication, and is also conducive to building a wide-area large-scale internet of things. The Wi-SUN standard mainly consists of two sub-specifications, namely FAN and HAN. ...
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