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  •  CC3200 WLAN / Wi-Fi Module RF-WM-3200B3
  •  CC3200 WLAN / Wi-Fi Module RF-WM-3200B3
  •  CC3200 WLAN / Wi-Fi Module RF-WM-3200B3
  •  CC3200 WLAN / Wi-Fi Module RF-WM-3200B3

Low Consumption 2.4G CC3200 WLAN / Wi-Fi Module RF-WM-3200B3

RF-WM-3200B3 Wi-Fi module is targeted at smart IoT applications. It is pin-2-pin compatible with TI CC3200MOD. The compact size and the high integration make the Wlan module popular among high-requirement applications.

  • P/N:

    RF-WM-3200B3
  • SoC:

    CC3200
  • Processor:

    ARM® Cortex™-M4 at 80 MHz
  • Protocols:

    Wi-Fi 2.4 GHz
  • Working Frequency:

    2412 MHz ~ 2472 MHz
  • Package (mm):

    20.5 × 17.5 × 2.5, 1.27 pitch, 63-pin
  • Features:

    802.11bgn, IPv4, 2 secure sockets, 1 STA
  • GPIO:

    27
  • Max. TX Power:

    +17 dBm (11 Mbps @ CCK)
  • Transmission Range:

    300 m

RF-WM-3200B3 WiFi module is designed based on TI SimpleLink CC3200 wireless SoC with the embedded high-performance ARM® Cortex™-M4 MCU. The module integrates the crystals, the 1 MB flash and the filter. The high integration allows the customer to develop an entire application with this single module and to save the PCBA space. This module supports AP (access point) mode, STA (station) mode and Wi-Fi Direct mode, and it also can work the subsystems including 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption. The Wlan module can be applied to WPA2 personal and enterprise security and WPS 2.0. Its TCP/IP and TLS/SSL stacks, HTTP server, and multiple Internet protocols enable the module to be able to enter a large range of applications.


Features of CC3200 WLAN / Wi-Fi Module RF-WM-3200B3


- Applications -

· Multiparameter Patient Monitor

· Telehealth Systems

· Low-Power Camera

· HVAC Systems

· Thermostat

· Factory Automation

Applications of CC3200 WLAN / Wi-Fi Module RF-WM-3200B3

Wireless SoC:

  • 80 MHz ARM® Cortex®-M4 processor
  • TX power:
    • +17 dBm (IEEE 802.11 B, 11 Mbps @ CCK)
    • +13 dBm (IEEE 802.11 G, 54 Mbps @ OFDM)
    • +12 dBm (IEEE 802.11 N, HT20 @ MCS7)
  • Sensitivity: 
    • -80 dBm (IEEE 802.11 B, 11 Mbps @ CCK)
    • -69 dBm (IEEE 802.11 G, 54 Mbps @ OFDM)
    • -67 dBm (IEEE 802.11 N, HT20 @ MCS7)
  • Memory
    • 1 MB flash
    • 256 kB RAM
  • Application Throughput:
    • UDP: 16 Mbps
    • TCP: 13 Mbps
  • Security:
    • AES, DES, and 3DES
    • SHA2 and MD5
    • CRC and Checksum


Wi-Fi Network Processor Subsystem

  • Featuring Wi-Fi internet-on-a-chipTM 
  • Dedicated ARM MCU
    • Completely offloads Wi-Fi and internet protocol from the application microcontroller
  • Wi-Fi and internet protocols in ROM
  • 802.11 b/g/n radio, baseband, medium access control (MAC), Wi-Fi driver, and supplicant
  • TCP/IP stack
    • Industry-standard BSD socket APIs
    • 8 simultaneous TCP or UDP sockets
    • 2 simultaneous TLS and SSL sockets
  • Powerful crypto engine for fast, secure Wi-Fi and internet connections with 256-bits AES encryption for TIS and SSL connections
  • Station, AP, and Wi-Fi direct® modes
  • WPA2 personal and enterprise security
  • SimpleLink connection manager for autonomous and fast Wi-Fi connections
  • SmartConfigTM technology, AP mode, and WPS2 for easy and flexible Wi-Fi provisioning

Operating Range:

  • Supply voltage range 2.1 V ~ 3.6 V
  • Working temperature range: -40 °C ~ +85 °C
  • Frequency: 2412 MHz ~ 2472 MHz


Rich Peripherals:

  • Parallel camera
  • McASP
  • I²S
  • SD/MMC
  • UART
  • SPI
  • I²C
  • PWM
  • ADC


TI CC32xx Series Wi-Fi Modules
Part Number RF-WM-3235B1S RF-WM-3235A1S RF-WM-3235B1 RF-WM-3235A1 RF-WM-3220B1 RF-WM-3200B3 RF-WM-3200B1
Photo
IC CC3235S CC3235S CC3235SF CC3235SF CC3220SF CC3200 CC3200
Core 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4
Antenna Pad PCB/Pad Pad PCB/Pad Chip/IPEX/Pad Pad Chip/IPEX/Pad
RAM 256 KB 256 KB 256 KB 256 KB 256 KB 256 KB 256 KB
Flash 4 MB (Module Embedded) 4 MB (Module Embedded) 1 MB (IC Embedded) 4 MB (Module Embedded) 1 MB (IC Embedded) 4 MB (Module Embedded) 1 MB (IC Embedded) 4 MB (Module Embedded) 1 MB (Module Embedded) 1 MB (Module Embedded)
Protocols 802.11 a/b/g/n: 2.4 GHz and 5 GHz 802.11 a/b/g/n: 2.4 GHz and 5 GHz 802.11 a/b/g/n: 2.4 GHz and 5 GHz 802.11 a/b/g/n: 2.4 GHz and 5 GHz 802.11 b/g/n: 2.4 GHz 802.11 b/g/n: 2.4 GHz 802.11 b/g/n: 2.4 GHz
Power Supply 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V
Frequency Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 120 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 120 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 120 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 120 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 135 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Hibernate: 4.0 µA Low-power deep sleep (LPDS): 250 µA Idle connected (MCU in LPDS): 825 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 229 mA Hibernate: 4.0 µA Low-power deep sleep (LPDS): 250 µA Idle connected (MCU in LPDS): 825 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 229 mA
Max. TX Power +18.0 dBm @ 2.4 GHz (1 DSSS) +18.1 dBm @ 5 GHz (6 OFDM) +18.0 dBm @ 2.4 GHz (1 DSSS) +18.1 dBm @ 5 GHz (6 OFDM) +18.0 dBm @ 2.4 GHz (1 DSSS) +18.1 dBm @ 5 GHz (6 OFDM) +18.0 dBm @ 2.4 GHz (1 DSSS) +18.1 dBm @ 5 GHz (6 OFDM) +18 dBm @ 1 DSSS +14.5 dBm @ 54 OFDM +18 dBm @ 1 DSSS +14.5 dBm @ 54 OFDM +18 dBm @ 1 DSSS +14.5 dBm @ 54 OFDM
Receiving Sensitivity -96 dBm @2.4 GHz (1 DSSS) -92 dBm @5 GHz (6 OFDM) -96 dBm @2.4 GHz (1 DSSS) -92 dBm @5 GHz (6 OFDM) -96 dBm @2.4 GHz (1 DSSS) -92 dBm @5 GHz (6 OFDM) -96 dBm @2.4 GHz (1 DSSS) -92 dBm @5 GHz (6 OFDM) -96 dBm @ 1 DSSS -74.0 dBm @ 54 OFDM -96 dBm @ 1 DSSS -74.0 dBm @ 54 OFDM -96 dBm @ 1 DSSS -74.0 dBm @ 54 OFDM
Security WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise, WPA3™ Personal, Crypto Engine: (AES, DES, SHA/MD5, CRC) WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise, WPA3™ Personal, Crypto Engine: (AES, DES, SHA/MD5, CRC) WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise, WPA3™ Personal, Crypto Engine: (AES, DES, SHA/MD5, CRC) WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise, WPA3™ Personal, Crypto Engine: (AES, DES, SHA/MD5, CRC) WPA2 Personal and Enterprise Security: WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise (802.1x), Crypto Engine: AES, DES, 3DES, SHA2, MD5, CRC, and Checksum; Secure Sockets (SSLv3, TLS1.0, TLS1.1, TLS1.2) Crypto Engine: AES, DES, and 3DES, SHA2 and MD5, CRC and Checksum Crypto Engine: AES, DES, and 3DES, SHA2 and MD5, CRC and Checksum
Peripheral PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, McASP, UART, I2S, I2C, SPI, SD/MMC, ADC, 8-bit parallel camera interface PWM, McASP, UART, I2S, I2C, SPI, SD/MMC, ADC, 8-bit parallel camera interface
GPIO 27 27 27 27 27 27 27
Working Temperature -40 ℃ ~ +85 ℃ -40 ℃ ~ +105 ℃ -40 ℃ ~ +85 ℃ -40 ℃ ~ +85 ℃ -40 ℃ ~ +85 ℃ -40 ℃ ~ +85 ℃ -40 ℃ ~ +85 ℃
Storage Temperature -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃
Transmission Range 200 m (external PCB antenna) 150 m 200 m (external PCB antenna) 150 m 100 m (Chip antenna) 200 m (external PCB antenna) 100 m (Chip antenna)
Dimension (mm) 20.5 x 17.5 x 1.7 25.0 x 20.5 x 2.3 20.5 x 17.5 x 1.7 25 x 20.5 x 2.3 31.0 x 20.0 x 2.3 20.5 x 17.5 x 2.3 31.0 x 20.0 x 2.3
Package LGA LGA LGA LGA 1.27-mm pitch half-hole LGA 1.27-mm pitch half-hole
Functions Dual frequency Wi-Fi, Low-power 5G, Compatible with TI CC3232MODS Dual frequency Wi-Fi, Low-power 5G, Compatible with TI CC3232MODAS Dual frequency Wi-Fi, Low-power 5G, Compatible with TI CC3232MODSF Dual frequency Wi-Fi, Low-power 5G, Compatible with TI CC3232MODASF Multiple antenna output modes Lower power consmption, Compatible with TI CC3200MOD Lower power consmption, Support AT commands
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