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  • CC3235SF 2.4 GHz & 5 GHz dual-band WiFi Module
  • CC3235SF 2.4 GHz & 5 GHz dual-band WiFi Module
  • CC3235SF 2.4 GHz & 5 GHz dual-band WiFi Module
  • CC3235SF 2.4 GHz & 5 GHz dual-band WiFi Module
  • CC3235SF 2.4 GHz & 5 GHz dual-band WiFi Module

CC3235SF 2.4 GHz & 5 GHz dual-band Wi-Fi Module with 1MB + 4 MB Flash RF-WM-3235B1

RF-WM-3235B1 WLAN module is aimed at a dual-band Wi-Fi market. It is pin-2-pin compatible with TI CC3235MODSF. The large flash and the compact size make the module do a great job in some high requirements applications.

  • P/N:

    RF-WM-3235B1
  • SoC:

    CC3235SF
  • Processor:

    ARM® Cortex™-M4 at 80 MHz
  • Protocols:

    Wi-Fi 2.4 GHz, Wi-Fi 5 GHz
  • Working Frequency:

    2412 MHz ~ 2472 MHz, 5180 MHz ~ 5825 MHz
  • Package (mm):

    20.5 × 17.5 × 2.5, 1.27 pitch, 63-pin
  • Features:

    802.11 a/b/g/n, IPv4 & IPv6, 16 secure sockets, 4 STA's, 2.4-GHz coexistence, pin-2-pin compatible with TI CC3235MODSF
  • GPIO:

    27
  • Max. TX Power:

    +18.0 dBm @ 2.4 GHz (1 DSSS), +18.1 dBm @ 5 GHz (6 OFDM)
  • Transmission Range:

    300 m

RF-WM-3235B1 wlan module is developed based on TI SimpleLink CC3235SF wireless SoC with the high-performance ARM® Cortex™-M4 MCU. The module integrates the crystals, a 1 MB embedded flash, an external 4 MB flash, and a 2.4 GHz & 5 GHz combiner. This module supports AP (access point) mode, STA (station) mode and Wi-Fi Direct mode (only for 2.4 GHz). Its network processor can run all Wi-Fi and internet logical layers. This ROM-based subsystem completely offloads the host MCU and includes an 802.11 a/b/g/n dual-band 2.4 GHz and 5 GHz radio, baseband, and MAC with powerful hardware cryptography engine. The module also supports the following features: 802.11a (5 GHz), antenna selection, up to 16 concurrent secure sockets, certificate sign request (CSR), Online certificate status protocol (OCSP), Wi-Fi® Alliance certified IoT power-saving features (such as DMS, proxy ARP, and so forth), the hostless mode for offloading template packet transmissions, improved fast scan, etc.


Features of TI SimpleLink CC3235SF WLAN module


- Applications -

· Medical and Healthcare

· Gateway

· E-locks 

· Appliances

· Asset Tracking

· Grid Infrastructure 

Applications of TI SimpleLink CC3235SF WLAN module


Wireless SoC:


  • 80 MHz ARM® Cortex®-M4 processor
  • TX power:
    • +18.0 dBm @ 2.4 GHz (1 DSSS)
    • +18.1 dBm @ 5 GHz (6 OFDM)
  • Sensitivity: 
    • -96 dBm @2.4 GHz (1 DSSS)
    • -92 dBm @5 GHz (6 OFDM)
  • Memory
    • 1 MB embedded + 4 MB external flash
    • 256 kB RAM
  • Application Throughput:
    • UDP: 16 Mbps
    • TCP: 13 Mbps
  • Security:
    • WEP
    • WPA™/ WPA2™ PSK
    • WPA2 Enterprise
    • WPA3™ Personal
    • WPA3™ Enterprise

 

Wi-Fi Network Processor Subsystem


  • 802.11 a/b/g/n 2.4 GHz and 5 GHz
  • Modes:
    • Access point (AP)
    • Station (STA)
    • Wi-Fi Direct® (only supported on 2.4 GHz)
  • Internet and application protocols:
    • HTTPs server, mDNS, DNS-SD, DHCP
    • IPv4 and IPv6 TCP/IP stack
    • 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)

Multilayered security features:


  • Separate execution environments
  • Networking security
  • Device identity and key
  • Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
  • File system security (encryption, authentication, access control)
  • Initial secure programming
  • Software tamper detection
  • Secure boot
  • Certificate signing request (CSR)
  • Unique per device key pair

  

Operating Range:


  • Supply voltage range 2.1 V ~ 3.6 V
  • Working temperature range: -40 °C ~ +85 °C
  • Frequency: 2412 MHz ~ 2472 MHz, 5180 MHz ~ 5825 MHz


Rich Peripherals:


  • Parallel camera
  • McASP
  • I²S
  • SD/MMC
  • UART
  • SPI
  • I²C
  • PWM
  • ADC


TI CC32xx Series Wi-Fi Modules
Part Number RF-WM-3235B1S RF-WM-3235A1S RF-WM-3235B1 RF-WM-3235A1 RF-WM-3220B1 RF-WM-3200B3 RF-WM-3200B1
Photo
IC CC3235S CC3235S CC3235SF CC3235SF CC3220SF CC3200 CC3200
Core 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4
Antenna Pad PCB/Pad Pad PCB/Pad Chip/IPEX/Pad Pad Chip/IPEX/Pad
RAM 256 KB 256 KB 256 KB 256 KB 256 KB 256 KB 256 KB
Flash 4 MB (Module Embedded) 4 MB (Module Embedded) 1 MB (IC Embedded) 4 MB (Module Embedded) 1 MB (IC Embedded) 4 MB (Module Embedded) 1 MB (IC Embedded) 4 MB (Module Embedded) 1 MB (Module Embedded) 1 MB (Module Embedded)
Protocols 802.11 a/b/g/n: 2.4 GHz and 5 GHz 802.11 a/b/g/n: 2.4 GHz and 5 GHz 802.11 a/b/g/n: 2.4 GHz and 5 GHz 802.11 a/b/g/n: 2.4 GHz and 5 GHz 802.11 b/g/n: 2.4 GHz 802.11 b/g/n: 2.4 GHz 802.11 b/g/n: 2.4 GHz
Power Supply 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V
Frequency Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 120 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 120 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 120 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 120 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 135 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Hibernate: 4.0 µA Low-power deep sleep (LPDS): 250 µA Idle connected (MCU in LPDS): 825 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 229 mA Hibernate: 4.0 µA Low-power deep sleep (LPDS): 250 µA Idle connected (MCU in LPDS): 825 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 229 mA
Max. TX Power +18.0 dBm @ 2.4 GHz (1 DSSS) +18.1 dBm @ 5 GHz (6 OFDM) +18.0 dBm @ 2.4 GHz (1 DSSS) +18.1 dBm @ 5 GHz (6 OFDM) +18.0 dBm @ 2.4 GHz (1 DSSS) +18.1 dBm @ 5 GHz (6 OFDM) +18.0 dBm @ 2.4 GHz (1 DSSS) +18.1 dBm @ 5 GHz (6 OFDM) +18 dBm @ 1 DSSS +14.5 dBm @ 54 OFDM +18 dBm @ 1 DSSS +14.5 dBm @ 54 OFDM +18 dBm @ 1 DSSS +14.5 dBm @ 54 OFDM
Receiving Sensitivity -96 dBm @2.4 GHz (1 DSSS) -92 dBm @5 GHz (6 OFDM) -96 dBm @2.4 GHz (1 DSSS) -92 dBm @5 GHz (6 OFDM) -96 dBm @2.4 GHz (1 DSSS) -92 dBm @5 GHz (6 OFDM) -96 dBm @2.4 GHz (1 DSSS) -92 dBm @5 GHz (6 OFDM) -96 dBm @ 1 DSSS -74.0 dBm @ 54 OFDM -96 dBm @ 1 DSSS -74.0 dBm @ 54 OFDM -96 dBm @ 1 DSSS -74.0 dBm @ 54 OFDM
Security WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise, WPA3™ Personal, Crypto Engine: (AES, DES, SHA/MD5, CRC) WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise, WPA3™ Personal, Crypto Engine: (AES, DES, SHA/MD5, CRC) WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise, WPA3™ Personal, Crypto Engine: (AES, DES, SHA/MD5, CRC) WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise, WPA3™ Personal, Crypto Engine: (AES, DES, SHA/MD5, CRC) WPA2 Personal and Enterprise Security: WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise (802.1x), Crypto Engine: AES, DES, 3DES, SHA2, MD5, CRC, and Checksum; Secure Sockets (SSLv3, TLS1.0, TLS1.1, TLS1.2) Crypto Engine: AES, DES, and 3DES, SHA2 and MD5, CRC and Checksum Crypto Engine: AES, DES, and 3DES, SHA2 and MD5, CRC and Checksum
Peripheral PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, McASP, UART, I2S, I2C, SPI, SD/MMC, ADC, 8-bit parallel camera interface PWM, McASP, UART, I2S, I2C, SPI, SD/MMC, ADC, 8-bit parallel camera interface
GPIO 27 27 27 27 27 27 27
Working Temperature -40 ℃ ~ +85 ℃ -40 ℃ ~ +105 ℃ -40 ℃ ~ +85 ℃ -40 ℃ ~ +85 ℃ -40 ℃ ~ +85 ℃ -40 ℃ ~ +85 ℃ -40 ℃ ~ +85 ℃
Storage Temperature -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃
Transmission Range 200 m (external PCB antenna) 150 m 200 m (external PCB antenna) 150 m 100 m (Chip antenna) 200 m (external PCB antenna) 100 m (Chip antenna)
Dimension (mm) 20.5 x 17.5 x 1.7 25.0 x 20.5 x 2.3 20.5 x 17.5 x 1.7 25 x 20.5 x 2.3 31.0 x 20.0 x 2.3 20.5 x 17.5 x 2.3 31.0 x 20.0 x 2.3
Package LGA LGA LGA LGA 1.27-mm pitch half-hole LGA 1.27-mm pitch half-hole
Functions Dual frequency Wi-Fi, Low-power 5G, Compatible with TI CC3232MODS Dual frequency Wi-Fi, Low-power 5G, Compatible with TI CC3232MODAS Dual frequency Wi-Fi, Low-power 5G, Compatible with TI CC3232MODSF Dual frequency Wi-Fi, Low-power 5G, Compatible with TI CC3232MODASF Multiple antenna output modes Lower power consmption, Compatible with TI CC3200MOD Lower power consmption, Support AT commands
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